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3D BGA Reballing Stencil Power Logic Module BGA Reballing Repair Tool for iOS 5 5S 6 6S 7G 7Plus 8 8P Cheap $15.60
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3D BGA Reballing Stencil Hard Disk Module BGA Reballing Repair Tool for Phone 5 5S 6 6S 7G 7Plus 8 8P Fashion

$11.44

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SKU: US-8659952828731 Categories: ,
Description

Description

3D BGA Reballing Stencil Hard Disk Module BGA Reballing Repair Tool for Phone 5 5S 6 6S 7G 7Plus 8 8P
Features: 
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. 
New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard. 
Assisting professionals to do Phone X BGA reballing in the most convenient and safest way. 

Specification: 
Type: for PHone 7/7p / for PHone 6s/6sp / for PHone 6/6p. 

Package included: 
1 x BGA Reballing Tool

Shipping & Delivery

We accept returns on non-sale items that are in original packaging, unused, and unwashed within 30 days of receipt. Please follow our returns/exchanges process below. If items do not meet our requirements for return, they will be shipped back to you in lieu of a refund. Shipping and handling charges are non-refundable (exceptions may apply).

Returns & Exchanges Process: If item(s) fit within our returns guidelines found in the Returns. Please allow 7-10 business days for the credit to appear on your account after your return is processed.